ICEDA 2011 - 2011 International Conference on Electronic Design Automation(ICEDA 2011)
Date2011-12-02
Deadline2011-07-30
VenueBangkok, Thailand
KeywordsElectronic;Automation;Design
Websitehttp://www.iceda.org/
Topics/Call fo Papers
Call for Papers
The call for papers for the 2011 International Conference on Electronic Design Automation (ICEDA 2011) is now available at the ICEDA 2011 Web site. Authors are invited to submit original technical papers describing recent and novel research or engineering developments in all areas of design automation tools and methodologies, silicon solutions and embedded system-on chip topics. As part of the regular program, ICEDA 2011 will feature a theme day on entertainment, games and multimedia. In addition, this year ICEDA 2011 is expanding the technical program in the areas of beyond-die integration and packaging, including chip-package co-design, system-in-package (SIP) and new integration techniques such as 3D and stacked designs, and new and emerging design technologies, such as nanotechnologies, quantum and biological computing and micro electro mechanical systems (MEMS).
Submitted conference papers will be reviewed by technical committees of the Conference. The ICEDA 2011 conference proceeding will proudly published by ASME Press, and will be included in ASME Digital Library, and indexed by EI Compendex, Thomson ISI Proceedings.
SUBMISSION METHODS:
1. Electronic Submission System; ( .pdf)
If you can't login the submission system, please try to submit through method 2.
2. Email: iceda-AT-sie-edu.sg ( .pdf and .doc)
The call for papers for the 2011 International Conference on Electronic Design Automation (ICEDA 2011) is now available at the ICEDA 2011 Web site. Authors are invited to submit original technical papers describing recent and novel research or engineering developments in all areas of design automation tools and methodologies, silicon solutions and embedded system-on chip topics. As part of the regular program, ICEDA 2011 will feature a theme day on entertainment, games and multimedia. In addition, this year ICEDA 2011 is expanding the technical program in the areas of beyond-die integration and packaging, including chip-package co-design, system-in-package (SIP) and new integration techniques such as 3D and stacked designs, and new and emerging design technologies, such as nanotechnologies, quantum and biological computing and micro electro mechanical systems (MEMS).
Submitted conference papers will be reviewed by technical committees of the Conference. The ICEDA 2011 conference proceeding will proudly published by ASME Press, and will be included in ASME Digital Library, and indexed by EI Compendex, Thomson ISI Proceedings.
SUBMISSION METHODS:
1. Electronic Submission System; ( .pdf)
If you can't login the submission system, please try to submit through method 2.
2. Email: iceda-AT-sie-edu.sg ( .pdf and .doc)
Other CFPs
- 2011 International Conference on Computer and Computational Intelligence(ICCCI 2011)
- 2011 International Conference on Communication Engineering and Networks (ICCEN 2011)
- 3rd International Conference on Exploring Services Sciences
- 2012 International Conference on Information, Computing and Telecommunications
- International Conference on Applied Business and Economics (ICABE) 2011
Last modified: 2011-06-21 18:15:51