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MeshTech 2009 - MeshTech 2009 Third IEEE International Workshop on Enabling Technologies and Standards for Wireless Mesh Networking

Date2009-10-12

Deadline2009-06-01

VenueMacau, Macau SAR Macau SAR

Keywords

Websitehttps://www.ing.unipi.it/meshtech09

Topics/Call fo Papers

MeshTech 2009 Third IEEE International Workshop on Enabling Technologies and Standards for Wireless Mesh Networking

http://www.ing.unipi.it/meshtech09

co-located with IEEE MASS 2009
sponsored by IEEE, IEEE Computer Society,
IEEE TC on Distributed Processing,
IEEE TC on Simulation, and IEEE TC on Computer Communication

NEW DATE ---> October 12, 2009 <--- NEW DATE
Macau SAR, P.R. China

------------------------------------------------------------------------
SCOPE/CALL FOR PAPERS
With the emergence of wireless mesh networks new topologies appeared
that complement the classic base station centered deployments. On the
low complexity side, direct link set-ups like the IEEE 802.11 Task Group
"z" approach enable connectivity between end stations, thereby avoiding
unnecessary transmissions to and from an Access Point. The peer-to-peer
specification that Wi-Fi Alliance currently develops provides a more
powerful but also more complex approach. It targets at Bluetooth like
deployments, so as to allow for a private network to be easily set up.
Unlike the aforementioned projects, the wireless mesh networking
standards developed within IEEE 802.16, IEEE 802.11s, IEEE 802.15.5, the
IETF Next Generation Internet groups MIPSHOP, NETLMM, and MANET target
at full solutions that provide all features necessary to enable
spontaneous ad hoc connectivity within single hop range up to highly
scalable, self-healing, reliable and cost-effective multi-hop set-ups
for very diverse environments. Even beyond this scope, several research
projects survey the feasibility of mesh networks formed of heterogeneous
standards.

With the traditional network topologies fading away, wireless mesh
networks and their ad hoc relatives have become a hot topic in the
research community. However, the new topologies affect protocol designs
and interoperability with existing networks. Loop-free set-ups,
broadcast traffic handling, inter-standard mesh networks, hand over of
roaming devices, and the usage of mesh networks in TV whitespaces are
few examples that these new technologies need to be aware of.
Furthermore, it is still to be fully understood what technological
challenges the above mentioned standardization efforts have to face, how
they will evolve, and what application scenarios will be able to drive
their possible success in the market.

Building on the success of the previous editions, MeshTech 2009 aims at
bringing together again practitioners and researchers from both academia
and industry in order to discuss the recent advances and future
evolution of next generation peer-to-peer and mobile mesh/multihop relay
networking technologies and standards for Wireless Personal, Local,
Metropolitan, Rural and Regional Area Networks.

Within the scope of wireless mesh networks, topics of interest include,
but are not limited to:

- Routing protocols
- Medium access control protocols
- Quality of Service and fairness provisioning
- Mesh networks configuration and management
- Topology discovery, association and control
- Mesh networks measurement
- Mobility management
- Coexistence with existing wireless infrastructures
- Security architectures, functions and protocols
- Performance evaluation
- Comparative study of competing solutions
- Cross-layer design and optimization
- Cognitive and frequency-agile radios
- Fault tolerance, anomaly detection and error recovery schemes
- Interworking of heterogeneous standards wireless mesh networks
- Mesh networks for TV white spaces

PAPER SUBMISSION AND PUBLICATION
All submissions must describe original research, not published or
currently under review for another workshop, conference, or journal.
Papers must be submitted electronically to EDAS by May 20, 2009, 11:59pm
EDT. You can find detailed submission instructions at
http://www.ing.unipi.it/meshtech09/submission.shtm.... Submission implies
the willingness of at least one author to attend the workshop and
present the paper. Accepted papers will be included in the main
proceedings of IEEE MASS 2009 and published by IEEE.

IMPORTANT DATES
Manuscript Submission Due: June 1, 2009 (11:59pm EDT). ** EXTENDED **.
Acceptance Notification: July 5, 2009.
Final Manuscript Due: July 24, 2009.

WORKSHOP CO-CHAIRS
Guido R. Hiertz, Riedel Communications, Germany.
Enzo Mingozzi, University of Pisa, Italy.

TECHNICAL PROGRAM COMMITTEE.
Alfred Arnold, Lancom Systems, Germany.
Stefano Avallone, University of Naples, Italy.
Leonardo Badia, IMT Lucca, Italy.
Michael Bahr, Siemens AG, Germany.
Lars Berlemann, Deutsche Telekom, Germany.
Giuseppe Bianchi, University of Roma Tor Vergata, Italy.
Torsten Braun, University of Bern, Switzerland.
Antonio Capone, Polytechnic of Milano, Italy.
Javier Cardona, Cozy Bit, USA.
Dave Cavalcanti, Philips Research North America, USA.
Aik Chindapol, Nokia Siemens Networks, USA.
Claudio Cicconetti, University of Pisa, Italy.
Marco Conti, IIT-CNR, Italy.
Steve Emeott, Motorola, USA.
Karoly Farkas, University of West Hungary, Hungary.
Mesut Gunes, FU Berlin, Germany.
Dan Harkins, Aruba Networks, USA.
Stuart Kerry, OK-Brit, USA.
Kyeong Soo Kim, Institute of Advanced Telecommunications, Swansea University, UK.
Jarkko Kneckt, Nokia Research Center, Finland.
Taekyoung Kwon, Seoul National University, South Korea.
Luciano Lenzini, University of Pisa, Italy.
Azman Osman Lim, NICT, Japan.
Stefan Mangold, Swisscom, Switzerland.
Sebastian Max, RWTH Aachen, Germany.
Daniele Miorandi, Create-Net, Italy.
Mitsuo Nohara, KDDI Corporation, Japan.
Santosh Pandey, Cisco Systems, USA.
Holger Rosier, RWTH Aachen University, Germany.
Alexander Safonov, Russian Academy of Science, Russia.
Kazuyuki Sakoda, Sony Corporation, Japan.
Dong-Jye Shyy, MITRE, USA.
Vasilios Siris, University of Crete/FORTH-ICS, Greece.
Rakesh Taori, Samsung, South Korea.
Spiro Trikaliotis, Institut Automation und Kommunikation, Germany.
Jesse Walker, Intel Corporation, USA.
Xudong Wang, TeraNovi Technologies, Inc., USA.
Christian Wietfeld, University of Dortmund, Germany.
Yunpeng Zang, RWTH Aachen, Germany.
Yuan Zhou, Huawei Technologies, P.R. China.

Last modified: 2010-06-04 19:32:22