ICICM 2021 - 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)
Date2021-10-22 - 2021-10-24
Deadline2021-09-10
VenueNanjing, China
KeywordsIntegrated Circuits; Microsystems
Websitehttps://www.icicm.net
Topics/Call fo Papers
Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus
Abbreviation: ICICM 2021
Time: October 22-24, 2021
Place: Nanjing,China
Website: http://www.icicm.net/
==Submission
(For early submission, it will get the feedback within 1 month)
==Publication: Conference Proceeding
==Indexed by: Ei Compendex, and Scopus, etc.
==Submission email: icicmatyoung.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)
==Find the tempalte with the link: http://icicm.net/files/Template.doc
★Co-sponsored by★
University of Electronic Science and Technology of China, China
Technology of China and Southeast University, China
★ICICM Committees★
Advisory Chairs
David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow)
Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow)
Conference Chairs
Zhigong Wang, Southeast University, China
Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter)
Program Chairs
Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow)
Zou Zhuo, Fudan University, China(Senior Member of IEEE)
Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden
Steering Committee Chair
Huang Le Tian, University of Electronic Science and Technology of China, China
For more members, please visite conference website: http://www.icicm.net/committee.html
★History★
Papers of ICICM2020 can be checked in IEEE Xplore!
Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2
Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1
Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5
Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3
★Topics★
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)
★Conference Contact★
Ms Zeng
Email: icicmatyoung.ac.cn
Tel: +86-28-87777577
Web: www.icicm.net
Abbreviation: ICICM 2021
Time: October 22-24, 2021
Place: Nanjing,China
Website: http://www.icicm.net/
==Submission
(For early submission, it will get the feedback within 1 month)
==Publication: Conference Proceeding
==Indexed by: Ei Compendex, and Scopus, etc.
==Submission email: icicmatyoung.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)
==Find the tempalte with the link: http://icicm.net/files/Template.doc
★Co-sponsored by★
University of Electronic Science and Technology of China, China
Technology of China and Southeast University, China
★ICICM Committees★
Advisory Chairs
David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow)
Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow)
Conference Chairs
Zhigong Wang, Southeast University, China
Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter)
Program Chairs
Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow)
Zou Zhuo, Fudan University, China(Senior Member of IEEE)
Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden
Steering Committee Chair
Huang Le Tian, University of Electronic Science and Technology of China, China
For more members, please visite conference website: http://www.icicm.net/committee.html
★History★
Papers of ICICM2020 can be checked in IEEE Xplore!
Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2
Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1
Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5
Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3
★Topics★
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)
★Conference Contact★
Ms Zeng
Email: icicmatyoung.ac.cn
Tel: +86-28-87777577
Web: www.icicm.net
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Last modified: 2021-08-26 15:10:51