JECE 2012 - Special Issue on Energy and Thermal Management of Embedded Computing
Topics/Call fo Papers
Journal of Electrical and Computer Engineering
Special Issue on Energy and Thermal Management of Embedded Computing
(Link: http://www.hindawi.com/journals/jece/si/etm/)
Call for Papers
Excessive energy dissipation has become one of the limiting
factors for the sustained growth of today’s embedded
computing technology. High power consumption and
power density reduce system reliability, increase energy
as well as cooling cost, and cut the battery lifetime
of mobile devices. Runtime energy/thermal management
dynamically consolidates workload of computers, adjusts the
power/performance mode of devices, and finds tradeoffs
between quality of services (QoS) and energy dissipation.
Those runtime management actions usually bring significant
performance and energy overhead and should be chosen
carefully with the consideration of the hardware and software
environments, the user activities and QoS requirements, the
battery efficiency, the communication protocols, and the
routing algorithms. The main goal of this special issue is to
provide a forum for the researchers to share the most recent
developments and ideas on energy/thermal management in
various areas of embedded computing, from application,
OS, and middleware development to communication and
network optimization.We also welcome contributions focusing
on energy/thermal management of embedded systems
powered by novel energy sources or utilizing innovative
energy storage techniques.
The topics to be covered include,but are not limited to:
? Energy-/temperature-aware algorithm design
? Runtime power/energy/thermal management
? Energy/thermal analysis or optimization in various
computing and communication layers
? Energy-aware operating system kernels and modules
? Energy/thermal modeling and simulation
? Energy-/temperature-aware distributed computing
? Ultralow energy design space-sub/near threshold computing
in embedded systems
? Design and optimization of embedded systems based
on renewable energy
? Battery-aware optimization of computing and communication
? Co-optimization of cooling power and computation/
communication power
? Network infrastructures for enhanced energy/thermal
management
? Energy-aware multicore architectures
? Context-aware energy/thermal management of
embedded computing
? Energy footprinting of embedded computing systems
? Energy/thermal workload/benchmark analysis and
characterization
? Experiences, case studies, and lessons learned for
energy-/temperature-aware embedded computing
applications
Before submission authors should carefully read over the
journal’s Author Guidelines, which are located at
http://www.hindawi.com/journals/jece/guidelines/.
Prospective authors should submit an electronic copy of
their complete manuscript through the journal Manuscript
Tracking System at http://mts.hindawi.com/ according to
the following timetable:
Manuscript Due August 15, 2011 (Extended)
First Round of Reviews October 15, 2011
Publication Date January 15, 2012
Lead Guest Editor
Qinru Qiu, Department of Electrical and Computer Engineering,
Binghamton University,
Binghamton, NY, 13902, USA;
qqiu-AT-binghamton.edu
Guest Editors
Ayse Kivilcim Coskun, Department of Electrical and Computer Engineering,
Boston University,
Boston, MA, 02215, USA;
acoskun-AT-bu.edu
Dhireesha Kudithipudi, Department of Computer Engineering,
Rochester Institute of Technology,
Rochester, NY 14623, USA;
dxkeec-AT-rit.edu
Song Ci, Department of Computer and Electronics Engineering,
University of Nebraska-Lincoln,
200B PeterKiewit Institute,
Omaha, NE 68182, USA;
sci-AT-engr.unl.edu
Special Issue on Energy and Thermal Management of Embedded Computing
(Link: http://www.hindawi.com/journals/jece/si/etm/)
Call for Papers
Excessive energy dissipation has become one of the limiting
factors for the sustained growth of today’s embedded
computing technology. High power consumption and
power density reduce system reliability, increase energy
as well as cooling cost, and cut the battery lifetime
of mobile devices. Runtime energy/thermal management
dynamically consolidates workload of computers, adjusts the
power/performance mode of devices, and finds tradeoffs
between quality of services (QoS) and energy dissipation.
Those runtime management actions usually bring significant
performance and energy overhead and should be chosen
carefully with the consideration of the hardware and software
environments, the user activities and QoS requirements, the
battery efficiency, the communication protocols, and the
routing algorithms. The main goal of this special issue is to
provide a forum for the researchers to share the most recent
developments and ideas on energy/thermal management in
various areas of embedded computing, from application,
OS, and middleware development to communication and
network optimization.We also welcome contributions focusing
on energy/thermal management of embedded systems
powered by novel energy sources or utilizing innovative
energy storage techniques.
The topics to be covered include,but are not limited to:
? Energy-/temperature-aware algorithm design
? Runtime power/energy/thermal management
? Energy/thermal analysis or optimization in various
computing and communication layers
? Energy-aware operating system kernels and modules
? Energy/thermal modeling and simulation
? Energy-/temperature-aware distributed computing
? Ultralow energy design space-sub/near threshold computing
in embedded systems
? Design and optimization of embedded systems based
on renewable energy
? Battery-aware optimization of computing and communication
? Co-optimization of cooling power and computation/
communication power
? Network infrastructures for enhanced energy/thermal
management
? Energy-aware multicore architectures
? Context-aware energy/thermal management of
embedded computing
? Energy footprinting of embedded computing systems
? Energy/thermal workload/benchmark analysis and
characterization
? Experiences, case studies, and lessons learned for
energy-/temperature-aware embedded computing
applications
Before submission authors should carefully read over the
journal’s Author Guidelines, which are located at
http://www.hindawi.com/journals/jece/guidelines/.
Prospective authors should submit an electronic copy of
their complete manuscript through the journal Manuscript
Tracking System at http://mts.hindawi.com/ according to
the following timetable:
Manuscript Due August 15, 2011 (Extended)
First Round of Reviews October 15, 2011
Publication Date January 15, 2012
Lead Guest Editor
Qinru Qiu, Department of Electrical and Computer Engineering,
Binghamton University,
Binghamton, NY, 13902, USA;
qqiu-AT-binghamton.edu
Guest Editors
Ayse Kivilcim Coskun, Department of Electrical and Computer Engineering,
Boston University,
Boston, MA, 02215, USA;
acoskun-AT-bu.edu
Dhireesha Kudithipudi, Department of Computer Engineering,
Rochester Institute of Technology,
Rochester, NY 14623, USA;
dxkeec-AT-rit.edu
Song Ci, Department of Computer and Electronics Engineering,
University of Nebraska-Lincoln,
200B PeterKiewit Institute,
Omaha, NE 68182, USA;
sci-AT-engr.unl.edu
Other CFPs
- Accredited TOGAF course for the Practitioners
- Accredited TOGAF course for the Practitioners
- Annual International Conference on Materials Science, Metal & Manufacturing
- Annual International Conference on Telecom & Digital Media Technology (TDMT 2011)
- 2nd Annual International Conference on Political Science, Sociology and International Relations(PSSIR 2012)
Last modified: 2011-07-17 17:20:03