ICICDT 2012 - 2012 IEEE International Conference on IC Design & Technology (ICICDT)
Date2012-05-30
Deadline2012-02-16
VenueAustin, USA - United States
Keywords
Websitehttps://www.icicdt.org
Topics/Call fo Papers
Papers are solicited on:
? Design approaches including system, circuit and EDA to manage power, leakage, process variation, signal integrity, reliability, yield, and manufacturability.
? Advanced VLSI design, including embedded and host processors, ASICs, memories sub-system, analog and mixed-signal circuits.
? Multicore System-on-Chip (SoC), System-in-Package (SiP), and IP reuse for fast design closure.
? Advanced materials, advanced metallization, and 3D interconnection as both, novel interconnect, scheme for future MPUs and approach for realization of SoCs.
? Process and circuit for advanced memories: ReRAM, PRAM, MRAM, FeRAM, eDRAMNanocrystal Memory, Flash, etc., with emphasis on reliability.
? Advanced transistor structures for bulk, multiple Gate, FDSOI, PDSOI, SSOI, SiGe, etc technologies
? RF & analog properties of advanced devices (MOS, Bip, MEMS …), RF, mmW & analog circuits on advanced technologies (planar, heterogeneous, 3D…)
? New gate materials for adjusting Vt, enhanced mobility & scalability, low leakage, and low power.
? SER, thermal, leakage, Plasma-Induced Damage (PID), reliability, yield, etc effects on advanced transistor structures and circuits.
? Simulation & modeling on advanced process, device & circuit.
? Nanotechnology materials, devices and circuits.
? ESD protection circuitry, mixed-voltage-tolerant I/O design, high speed and low power I/O buffer
? Emerging IC technologies and circuits crossover such as organic IC's, integrated sensors and actuators.
? High Power, High Voltage devices and technology
Prospective authors are invited to submit a camera-ready paper of maximum four pages in length, including figures and references. The authors should
obtain paper submission guidelines from http://www.ICICDT.org. Accepted/Invited papers will be included in the proceedings of the conference
(available on CD-ROM). Presented paper will be published in IEEE Xplore and accepted paper must be accompanied by a non-refundable
registration fee.
? Design approaches including system, circuit and EDA to manage power, leakage, process variation, signal integrity, reliability, yield, and manufacturability.
? Advanced VLSI design, including embedded and host processors, ASICs, memories sub-system, analog and mixed-signal circuits.
? Multicore System-on-Chip (SoC), System-in-Package (SiP), and IP reuse for fast design closure.
? Advanced materials, advanced metallization, and 3D interconnection as both, novel interconnect, scheme for future MPUs and approach for realization of SoCs.
? Process and circuit for advanced memories: ReRAM, PRAM, MRAM, FeRAM, eDRAMNanocrystal Memory, Flash, etc., with emphasis on reliability.
? Advanced transistor structures for bulk, multiple Gate, FDSOI, PDSOI, SSOI, SiGe, etc technologies
? RF & analog properties of advanced devices (MOS, Bip, MEMS …), RF, mmW & analog circuits on advanced technologies (planar, heterogeneous, 3D…)
? New gate materials for adjusting Vt, enhanced mobility & scalability, low leakage, and low power.
? SER, thermal, leakage, Plasma-Induced Damage (PID), reliability, yield, etc effects on advanced transistor structures and circuits.
? Simulation & modeling on advanced process, device & circuit.
? Nanotechnology materials, devices and circuits.
? ESD protection circuitry, mixed-voltage-tolerant I/O design, high speed and low power I/O buffer
? Emerging IC technologies and circuits crossover such as organic IC's, integrated sensors and actuators.
? High Power, High Voltage devices and technology
Prospective authors are invited to submit a camera-ready paper of maximum four pages in length, including figures and references. The authors should
obtain paper submission guidelines from http://www.ICICDT.org. Accepted/Invited papers will be included in the proceedings of the conference
(available on CD-ROM). Presented paper will be published in IEEE Xplore and accepted paper must be accompanied by a non-refundable
registration fee.
Other CFPs
- 2012 2nd International Conference on Consumer Electronics, Communications and Networks (CECNet)
- 2012 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control and Communication (ISPCS)
- 2012 IEEE Long Island Systems, Applications and Technology Conference (LISAT)
- 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
- 2011 SSITE International Conference on Signal Processing, Pattern Recognition, and Applications ICSPPRA 2011
Last modified: 2011-06-05 11:51:51