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ICMPM 2021 - International Conference on Mechanical Properties of Materials 2021

Date2021-08-09 - 2021-08-10

Deadline2021-07-10

VenueHong Kong, Hong Kong SAR Hong Kong SAR

KeywordsMechanical; Properties; Material

Websitehttps://econf.co/icmpm2021

Topics/Call fo Papers

International Conference on Mechanical Properties of Materials 2021 provide a leading forum for the presentation of new advances and research results in the fields of Mechanical Properties of Materials. The conference will bring together leading researchers, Businessman and scientists in the domain of interest from around the world. Accordingly, Topics of interest for submission include, but are not limited to:
Conference Topics
Advanced Characterization
Biological Materials
Bulk Crystal Growth
Characterization
Computational Materials Science
Corrosion and Environmental Effects
Defects
Devices
Electrochemistry
Electronic Materials
Electronic, Optical, and Magnetic Properties
Magnetic Materials
Magnetic Properties
Manufacturing
Materials for Energy and Environmental Applications
Materials Processing
Materials Theory
Mechanical Behavior of Materials
Mechanical Properties and Nanomechanics
Nanopatterning
Nanotechnology
Optical and Photonic Materials
Optoelectronics
Organic Polymer Materials
Phase Transformations
Self-Assembly
Shape Deposition Manufacturing
Surfaces, Interfaces, and Thin Films
Thin-Film Deposition
Transport Properties

Last modified: 2020-11-04 20:32:49