IEEE NiVi09 2009 - IEEE Workshop on Networking Intelligent Vehicles and Infrastructures (IEEE NiVi09)

IEEE Workshop on Networking Intelligent Vehicles and Infrastructures (IEEE NiVi09)
http://snac.eas.asu.edu/workshop/NIVI09
Co-located with IEEE GLOBECOM 2009
Honolulu, Hawaii, USA

Call for Papers

Car-to-car (C2C) communication networks have now gain popularity and importance. New technical challenges have evolved that demand research and investigations. Globally, automobiles are indispensable for connecting people, delivering goods and services and commuting from one place to another. Car industries are of great importance in Asia, Europe, USA and the rest of the world. Car markers will be key players in car telematics. Much research remain to be done to bring alive the vision of future intelligent inter-vehicular applications, which will be supported by C2C.
This workshop is intended to serve as a forum and bring together the researchers and engineers in both academia and industry to exchange ideas, share experiences, and report original works about all aspects of service discovery and composition in ubiquitous and pervasive environments. The main purpose is to promote discussions of research and relevant activities in the design of architectures, algorithms, and applications for inter-vehicular communication environments. This workshop will also address some leading standardization efforts (802.11p, p1609, TIA TR48, etc.).
Technical research papers are solicited in the following areas:

ITS car-2-car networks
ITS car-2-roadside communications
MAC, routing, QoS, addressing, multicast, TCP protocols
Congestion Control and Cooperative VANETs
New application scenarios of ITS vehicular networks
Mobility and handoff issues
Sensors & Data Collection
Content Distribution
C2C communications
Intra-car communications
Traffic and flow control issues
Info Dissemination; Data organization
Security issues, architectures and solutions
Privacy issues and solutions
Data replication protocols in network partitions
Different technologies (DSRC, WiMAX, WiFi, 3G/4G, cell phone)
Application innovation
802.11p WAVE ; 802.11s MESH; DSRC
Implementation/deployment status
Standardization issues for C2C

Important Dates:
Paper Submission Deadline: 15 June 2009
Acceptance Notification: 1 August 2009
Camera-Ready Papers: 1 September 2009


Paper Submissions:
Paper submissions have to be made online at EDAS http://edas.info/N7797 in accordance with the submission procedures of IEEE GlobeCom. All submitted papers will be peer-reviewed.Accepted papers will be published in the IEEE Xplore. Further enquires can be directed to the TPC Chair and Vice Chairs.


--------------------------------------------------------------------------------
Organizing Committee:

General Co-Chairs:
Russell Hsing, Telcordia Technologies USA
Daniel Wong, 3G Wireless & Software, MALAYSIA
C K Toh, Univ. of Hong Kong, CHINA

Technical Program Committee Chair:
Hong Cheng, Telcordia Technologies, USA

Technical Program Committee Vice Chairs:
Li-Der Chou, National Central University, TAIWAN
Dijiang Huang, Arizona State Univ., USA
Michele Weigle, Old Dominion Univ., USA

Publicity Chair:
Wang Xin, Fudan Univ., CHINA

Publications Chair:
K C Leung, Univ. of Hong Kong, CHINA

Technical Program Committee Members (Tentative):
Dr. Onur Altintas, Toyota, USA
Dr. Fan Bai, GM R&D USA
Prof. Juan-Carlos Cano, Technical University of Valencia, SPAIN
Prof. Georg Carle, Technical University Munchen, GERMANY
Dr. Chungmin Chen, TARC-TW, TAIWAN
Prof. Yacine Doudane, LRSM Evry, Cedex FRANCE
Prof. Jonsson Erland, Chalmers U of Tech, SWEDEN
Dr. Andreas Festag, NEC, GERMANY
Dr. M. Fujise, NICT, JAPAN
Dr. Carolina Gilberga, Telefonica, SPAIN
Prof. Marco Gruteser, Rutgers University, USA
Prof. Hannes Hartenstein, University of Karlsruhe, GERMANY
Prof. Teruo Higashino, Osaka University, JAPAN
Prof. E Hossain, Manitoba University, CANADA
Prof. Y M Jang, Kookmin University, KOREA
Prof. D K Kim, Kyungpook National University, KOREA
Dr. Hang Liu, Thomson, USA
Prof. Pascal Lorenz, University of Haute Alsace, FRANCE
Prof. Michael Lyu, Chinese University of Hong Kong, CHINA
Prof. Mario Marchese, ITALY
Prof. Pietro Manzoni, Universi Politecnica De Valencia, SPAIN
Dr. Marc Necker, U of Stuttgart, GERMANY
Dr. Jarek Rykowski, Poznan University of Economics, POLAND
Dr. Junyi Wang, NICT, JAPAN
Dr. Christian Weiss, Daimler, GERMANY
Prof. Weidong Xiang, U of Michigan, USA
Dr. Wang Xin, Fudan University, CHINA
Dr. Kun Yang, Essex University, UK
Prof. Liuqing Yang, U of Florida, USA
Prof. Fei Richard Yu, Carleton University, CANADA
Dr. Tao Zhang, Telcordia, USA