TSP 2020 - 2020 43rd International Conference on Telecommunications and Signal Processing (TSP)

2020 43rd International Conference on Telecommunications and Signal
Processing (TSP)
July 6-8, 2020, Milan, Italy
Web: http://tsp.vutbr.cz/
Special Session and Workshop Proposals: January 15, 2020
Full Paper Submissions: February 15, 2020
***
Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa),
IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint
Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section
SP/CAS/COM Joint Chapter, and Scientific Association for
Infocommunications, a Sister Society of the IEEE and the IEEE
Communications Society.
The TSP 2020 Proceedings, containing presented papers at the Conference,
will be submitted for indexing to the IEEE Xplore® Digital Library -
IEEE Conference Record #49548, SCOPUS, Conference Proceedings Citation
Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.
After the conference, authors of about 25% highest rated papers will
also be invited to submit the extended version for publishing in Special
Journal Issues (papers to be published after significant extension and
new review process).
***
Dear Colleague,
You are kindly invited to participate in the 2020 43rd International
Conference on Telecommunications and Signal Processing (TSP -
http://tsp.vutbr.cz/), which will be held on July 6-8, 2020, in Milan,
Italy.
The TSP Conference serves as a premier annual international forum to
promote the exchange of the latest advances in telecommunication
technology and signal processing. The aim of the Conference is to bring
together both novice and experienced scientists, developers, and
specialists, to meet new colleagues, collect new ideas, and establish
new cooperation between research groups from universities, research
centers, and private sectors from the whole Europe, America, Asia,
Australia, and Africa.
TOPICS:
TSP 2020 has opened Call for Workshop and Special Session Proposals
(deadline set for January 15, 2020) and Call for Regular Full Paper
Submissions with a deadline February 15, 2020. We look forward to your
innovative contributions in any of the following areas:
AREA 1: Telecommunications
1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement
AREA 2: Signal Processing
6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing
For more details please visit the Conference website at
http://tsp.vutbr.cz/?page_id=121 .
WORKSHOPS AND SPECIAL SESSIONS:
Prospective Organizers are invited to submit proposals for Workshops and
Special Sessions held during the TSP 2020 Conference. Organizing
guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .
STUDENT BEST PAPER AWARD:
In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint
Chapter, to recognize outstanding technical contributions by students,
as evidenced by the quality of papers, their presentations, and their
technical excellence, the authors of the Best 5 Student Papers will be
awarded during the conference by the Technical Committee. The Best
Student Paper Award consists in a Plaque and a Certificate of Appreciation.
ORGANIZERS:
The TSP 2020 is IEEE technically co-sponsored Conference organized in
cooperation with eighteen universities:
- Brno University of Technology, Department of Telecommunications, Brno,
Czech Republic
- Budapest University of Technology and Economics, Department of
Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication
Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering,
Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication
Engineering Department, Istanbul, Turkey
- Josip Juraj Strossmayer University of Osijek, Faculty of Electrical
Engineering, Computer Science and Information Technology Osijek, Osijek,
Croatia
- Karadeniz Technical University, Department of Electrical and
Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of
Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and
Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology in Bratislava, Institute of Multimedia
Information and Communication Technologies, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia,
Bulgaria
- Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de
Saint-Denis (LIASD), France
- University “Politehnica” of Bucharest, Center for Advanced Research on
New Materials, Products and Innovative Processes (“CAMPUS”)
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana,
Slovenia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of
Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical
Engineering, Szczecin, Poland
COMMITTEES:
- Miloslav Filka, Brno University of Technology, Czech Republic – Full
Professor, TSP Conference Founder - Honorary Chair
- Norbert Herencsar, Brno University of Technology, Czech Republic –
IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior
Member - General Co-Chair
- Francesco Benedetto, University of “Roma TRE”, Italy – Full Professor,
IEEE Senior Member - General Co-Chair
- Jiri Hosek, Brno University of Technology, Czech Republic – IEEE
Member - Publications & Student Paper Contest Chair
- Aslihan Kartci, Brno University of Technology, Czech Republic – IEEE
Member - Publicity & Social Media Chair
- Nandor Matrai, Asszisztencia Congress Bureau, Hungary – Finance Chair
- Csilla Fulop, Asszisztencia Congress Bureau, Hungary – Registrations Chair
Steering Committee:
- Larbi Boubchir, Universite Paris 8, France – Associate Professor, IEEE
Senior Member
- Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataro,
Tecnocampus, Spain – Full Professor, Dean
- Izzet Cem Goknar, Isik University, Turkey – Institute of Science
Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full
Professor, IEEE Life Fellow
- Ray-Guang Cheng, National Taiwan University of Science and Technology
(NTUST), Taiwan – Full Professor, IEEE Senior Member
- Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
- Jaroslav Koton, Brno University of Technology, Czech Republic –
Vice-dean for Research, IEEE Senior Member
- Sridhar Krishnan, Ryerson University, Canada – Full Professor &
Associate Dean, IEEE Senior Member
- Mario Kusek, University of Zagreb, Croatia – IEEE Croatia Section
Communications Chapter Chair, IEEE Member
- Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair
Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior
Member
- Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior
Member
- Jiri Misurec, Brno University of Technology, Czech Republic – Full
Professor, Department Chair
- Ram M. Narayanan, The Pennsylvania State University, USA – Full
Professor, IEEE Fellow
- Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior
Member
- Serdar Ozoguz, Istanbul Technical University, Turkey – Full Professor,
Associate Chair
- Jakub Peksinski, West Pomeranian University of Technology, Poland
- Hector Perez-Meana, National Polytechnic Institute, Mexico – Full
Professor, IEEE Senior Member
- Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full
Professor, Dean, IEEE Senior Member
- Costas Psychalinos, University of Patras, Greece – Full Professor,
IEEE Senior Member
- Markus Rupp, Vienna University of Technology, Austria – Full
Professor, Dean, IEEE Fellow
- Zdenek Smekal, Brno University of Technology, Czech Republic – Full
Professor, IEEE Senior Member
- Attila Vidacs, Budapest University of Technology and Economics,
Hungary – Deputy Head of Department
- Miroslav Voznak, VSB-Technical University of Ostrava, Czech Republic –
Full Professor, Department Chair, IEEE Senior Member
- Drago Zagar, Josip Juraj Strossmayer University of Osijek, Croatia –
Full Professor, Dean, IEEE Senior Member
IMPORTANT DATES:
- Deadline for Special Session and Workshop Proposals: January 15, 2020
- Full Paper Submissions: February 15, 2020
- Notification of Paper Acceptance: April 15, 2020
- Final Paper Submission: April 30, 2020
- Authors' Early Registration and Payment: May 10, 2020
- Authors' Late Registration and Payment: May 20, 2020
- Conference: July 6-8, 2020
CONTACTS:
For more information please visit the Conference website at
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed
to tsp-AT-feec.vutbr.cz .
Looking forward to meeting you in Milan, Italy.
With best regards,
Norbert Herencsar and Francesco Benedetto
TSP 2020 General Co-Chairs
Web: http://tsp.vutbr.cz/
E-mail: tsp-AT-feec.vutbr.cz
Follow us on:
- Facebook https://www.facebook.com/tspconf/
- Twitter https://twitter.com/tspconf/
===
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic
&
Prof. Francesco Benedetto
Signal Processing for Telecommunications and Economics (SP4TE)
University of "Roma TRE"
via Vito Volterra, 62
00146 Rome
Italy