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ISSM 2011 - International Symposium on Semiconductor Manufacturing ( ISSM)

Date2011-09-05

Deadline2011-06-01

VenueHsinchu, Taiwan Taiwan

Keywords

Websitehttps://www.tsia.org.tw/Seminar/eManufac...

Topics/Call fo Papers

In collaboration with ISSM, this joint Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of interests:

Advanced Lithography
Benefits and Justification (ROI, CoO, OEE ...)
Contamination Control and Ultraclean Technology
Control Architecture/Engineering/IT Infrastructure
Cross-industrial Applications of PV/SSL/FPD/…
Data Collection/Quality/Storage/Management
Design for Manufacturing/Testing/Yield
e-Diagnostics, e-Manufacturing, and EEC
Engineering/Supply/Value Chains
Environment, Safety and Health
Equipment Control/Integration
Fab Management/Scheduling/Dispatching
Factory Design & Automated Material Handling
Factory Integration/Operations
Factory Physics & Queueing Operations
Fault Detection/Classification and Sensors
Final/Lean/Green Manufacturing
Manufacturing Control and Execution Systems
Manufacturing Strategy and Operation Management
Next Generation Factory & 450mm Wafers
Predictive/Preventive Maintenance
Process and Material Optimization
Process and Metrology Equipment
Process Control and Monitoring
Process Modeling and Model-Based Simulations
Process/Tool/Sensor Integrations
Standards (Equipment, Communications, …)
Through Silicon Via & 3D Structures
Ultra High Productivity in High-Volume Manufacturing
Yield Enhancement and WIP Management

Last modified: 2011-04-20 22:57:28