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TICEAS 2020 - 2020 The International Conference on Engineering and Applied Science (TICEAS)

Date2020-02-18 - 2020-02-20

Deadline2019-10-28

VenueGuam, USA - United States USA - United States

KeywordsElectronic Engineering; Information security; Data protection

Websitehttps://www.ticeas.org

Topics/Call fo Papers

The International Conference on Engineering and Applied Sciences will take place from February 18-20 in Guam.
This year, we will focus on the theme of “InfoSec, & CyberSecurity”.
Edging technologies such as mass data collection and cloud computing have been widely applied in our lives. With the popularity of the internet, abundant personal data have been shared in apps and networks, the confidentiality and integrity of data have been taken more seriously. How information security can be improved has become a significant issue discussed in the digital age.
We sincerely invite submission of abstracts/full papers relevant to “Engineering and Applied Sciences”.
Topics are listed but are not restricted to the followings:
InfoSec, & CyberSecurity (Conference Theme)
Biomedical Engineering
Chemical Engineering
Civil Engineering
Computer and IT Sciences
Electrical and Electronic Engineering
Environmental Engineering
Fundamental and Applied Sciences
Material Science and Engineering
Submit your paper to:http://www.ticeas.org

Last modified: 2019-08-22 15:40:31