MSSD 2019 - MSSD 2019 - 2019 International Conference on Material Science and Semiconductor Devices (MSSD2019)

Call For Papers - CFP
important information：
Website URL: https://www.keoaeic.org/MSSD2019
Start Date / End Date: November 15-17, 2019
Location: Shenzhen, China.
Submission Deadline: September 20, 2019
1.About the conference:
2019 International Conference on Material Science and Semiconductor Devices (MSSD2019) will be held on November 15-17, 2019 in Shenzhen, China. The aim is to provide an international platform for experts, engineers, researchers in material science and semiconductor devices to share research results and advanced technology. The conference also discusses the trend of academic development and helps to bridge the R&D results with industry. Another goal is to promote the establishing of business or research relations among global partners for future collaboration.We sincerely invite you to participate in MSSD 2019 and hope this event could meet and exceed your anticipation.
2.Publication
- Submit to the Conference
All accepted papers of MSSD 2019 will be published in the IOP Conference Series: Materials Science and Engineering(MSE) (ISSN:1757-8981), which will be submitted to EI Compendex (CPX), SCOPUS, CPCI for indexing.
*All submissions must not be less than 4 pages in length and papers should be submitted to ICMSSDatyeah.net.
- Submit to the SCI journal
*All submissions must not be less than 10 pages in length and papers should be submitted to serviceatkeoaeic.org and noted "SCI-ICMSSD".
Journal 1 (IF≈2.2): Study on the structure of chemical species;
Journal 2 (IF≈0.9): Energy-related technologies, science and equipments, thermals.
Journal 3(IF≈1): Bionic and Nano-biomaterials
Journal 4(IF≈1.6): New technology and application to promote the development of Engineering Composite Materials.
3.Important Dates
Submission Deadline：September 20, 2019
Notification Date: 1-2 weeks after submission
Registration Deadline：November 13, 2019
Conference Date：November 15-17, 2019
4.Submission Guides
- EI submission
Please submit the full paper(word+pdf) and Paper Submission Form to ICMSSDatyeah.net. You can download the EI template on the official website.
- SCI submission
Please submit the full paper(word+pdf) and Paper Submission Form to serviceatkeoaeic.org. You can download the SCI template on the official website.
5.Call For Papers
Material Science
(1) Fundamentals of Materials Science
(2) Material science and engineering
(3) Applications of Materials Science and Technology
More Related Topics
Semiconductor Devices
(1) Semiconductor Materials and Applications / Semiconductor Processing；
(2) Emerging Semiconductor Technologies；
(3) Novel Semiconductor Devices and Applications；
More Related Topics
Other related topics
6.Registration
Items
Registration fee (By US Dollar)
Regular Registration (4-6 pages)
450 USD/per paper
Additional Paper (4-6 pages)
430 USD/per paper
Extra Pages (Begin at Page 7)
50 USD/per extra page
Attendees without Papers
230 USD/per person
Attendees without Papers (Groups）
200 USD/per person (≥ 3 persons）
Purchase Extra Journal
75 USD/book
7.Schedule
Schedule
November15
13:00-17:00
Registration
November 16
09:00-12:00
Speeches of Keynote Speakers
12:00-14:00
Lunch
14:00-17:30
Oral Presentations
18:00-19:30
Banquet
November17
09:00-18:00
Academic Investigation
*A more detailed programme will be determined one month before the conference. Actual arrangements may be a little different from the table above because of the number of participants.
8.Contact Us
Conference Secretary: Ms. Xie
E-mail: ICMSSDatyeah.net
Tel: +86-13922157864 (cellphone)
WeChat: 13922157864
QQ: 1966347161
Website URL: https://www.keoaeic.org/MSSD2019