2020 - EI-ICDES 2020 : 5th International Conference on Design Engineering and Science (ICDES 2020)

Call for Papers
5th International Conference on Design Engineering and Science (ICDES 2020)
Feb. 27-29, 2020./Shenzhen, China
Web: http://www.icdes.org/
2020 5th International Conference on Design Engineering and Science (ICDES 2020) will be hosted in Shenzhen, China during Feb. 27-29, 2020, in conjunction with IC4M 2020. ICDES 2020 is organized by Hong Kong Society of Mechanical Engineers, technical sponsored by Loughborough University, Gent University, IQS, South China University of Technology and other organizations.
●Publication Information
1. All the registerd and presented papers of IC4M 2020 will be included in IOP Conference Series: Materials Science and Engineering(ISSN: 1757-899X), which will be indexed by Ei compendex, Scopus and Conference Proceedings Citation Index (Web of Science), and other databases for review and indexing.
2. High quality papers* will be recommended to publish in Journal of Remanufacturing (ISSN: 2210-464X (Print) 2210-4690 (Online))
3. Selected papers with great extension will be recommended to publish in Open Access journal - Journal of Manufacturing and Materials Processing (JMMP), free of charge.
● Keynote Speakers
1. Prof. Mohd Hamdi Bin Abd Shukor, University of Malaya,Malaysia
Prof Hamdi is a senior professor at the Department of Mechanical Engineering, University of Malaya. He received his bachelor degree from Imperial College London and his master degree from the University of Manchester. He was awarded the Monbusho scholarship to do his doctoral studies in Kyoto University. He is a Fellow of the Institution of Mechanical Engineers, UK. Prof Hamdi is a Charted Engineer with the Engineering Council, UK and a Professional Engineer with the Board of Engineers Malaysia. He is also a director and founder of the Centre of Advanced Manufacturing & Materials Processing, in which has grown from a modest-size team of researchers and engineers to an interdisciplinary research hub.
2. Prof. Yongbo Wu，Southern University of Science and Technology, China
The current research interests of Prof. Wu are in the multi-field (magnetic, electric, ultrasonic, solid-state chemical reaction) machining. He holds 16 Japanese and 13 Chinese invented patents in precision processing and is author of 5 book chapters, more than 170 refereed journal articles, 32 review articles, 85 international conference, and more than 190 domestic conference papers. Owing to his outstanding achievements in precision engineering, he has received 4 Awards from the major Japanese engineering societies: Japan Society of Mechanical Engineers (JSME), Japan Society for Precision Engineering (JSPE) and Japan Society for Abrasive Technology (JSAT), and is a named professor in the ”National Expert” of China. He has been serving for JSME as chief secretary of technical committee, JSPE as representative member, JSAT and KSMTE (Korean Society of Manufacturing Technology Engineers) as executive board members.
3. Prof. Kai Cheng,Brunel University, UK
Professor Cheng is a Chair Professor in Manufacturing Systems at Brunel University London. His current research interests focus on design of high precision machines, ultraprecision and micro/nano manufacturing, smart tooling and smart machining. Professor Cheng and his team have enjoyed working closely with industrial companies in the UK, Europe, USA and Far East. They are working on a number of research projects funded by the EPSRC, NATEP Program, RAEng, Innovate UK program, EU Horizon 2020 Programs, and the industry. Professor Cheng is a Charted Engineer and a Fellow of the IMechE and IET, and honored as the visiting professor at Harbin Institute of Technology.
● Invited Speaker
Dr. Simon K.S. Cheung ,Open University of Hong Kong, China
Director of Information Technology，The Open University of Hong Kong,Chartered Engineer, Engineering Council, UK, Chartered Scientist, Science Council, UK, Fellow, British Computer Society, UK, Fellow, Chartered Management Institute, UK, Fellow, Institution of Engineering and Technology, UK, Fellow, Institute of Mathematics and its Applications, UK, Fellow, Hong Kong Computer Society, Hong Kong, Fellow, Hong Kong Institution of Engineers, Hong Kong,Senior Member, Institute of Electrical and Electronics Engineers, USA.
●Topics(for more topics: http://www.icdes.org/cfp.html)
Design Methodology
Design process
Evaluation of design
Design and Development
Design of mechanical elements
Design and Production
Design management
CAD/CAM/CAE
Computer graphics
Surface characteristics
●Paper Submission
Submission Email: icdes-AT-smehk.org
Submission System: https://cmt3.research.microsoft.com/ICDES2020
●Call for participants
1,Presenter: If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us: icdes-AT-smehk.org
2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Science, you are welcome to join us and share your ideas!
3,Reviewer: Experts in the area of Design Engineering and Science are welcome to join the conference as reviewer. Send your CV to: icdes-AT-smehk.org
●Contact Us
Ms. Amber Cao
Email: icdes-AT-smehk.org
Tel:+852-30506862( Hong Kong)
Web: http://www.icdes.org/