ResearchBib Share Your Research, Maximize Your Social Impacts
Sign for Notice Everyday Sign up >> Login

ICESS 2017 - The Third International Conference on Electronics and Software Science (ICESS2017)

Date2017-07-31 - 2017-08-02

Deadline2017-07-01

VenueTakamatsu Sunport Hall Building, Takamatsu, Japan Japan

KeywordsComputer Science; Computer Engineering; Electronic snd electrical engi

Websitehttp://sdiwc.net/conferences/3rd-interna...

Topics/Call fo Papers

The Third International Conference on Electronics and Software Science (ICESS2017)
http://sdiwc.net/conferences/3rd-international-ele...
Takamatsu Sunport Hall Building, Takamatsu, Japan
July 31 - August 2, 2017
***
The conference aims to enable researchers to build connections between different digital applications.
The conference welcome papers on the following (but not limited to) research topics:
- Advanced Power System and Control System
- Analog and digital circuit Design
- Automobile Engineering
- Broad Band Communication
- Communication Computer and Intelligent Communication
- Control and Robotics
- Disaster Prevention Engineering
- e-Healthcare System
- Electromagnetics and Photonics
- Ergonomics and Application
- Expert Systems and Artificial Intelligence Techniques
- Feedback Control Systems
- High Voltage Engineering
- Information systems and network security
- Kansei Engineering
- Measurements and Instrumentation
- Mechatronics and Avionics
- Medical Engineering
- Nano Devices and Integrated Systems
- Non Conventional Energy Resources
- Optical Networks & communication
- Power Electronics
- Power Electronics & Electric Drives
- Power Electronics and Energy Efficient Drives
- Power Quality Improvement Techniques
- Power Systems
- Processing and Multimedia, Biomedical Imaging
- Remote sensing and satellite communication
- RF and Microwave Engineering
- Sensor technology & Virtual Instrumentation
- Server Virtualization Technology
- Soft Computing Techniques in Power Systems
- Software for Life Science
- Software for Material Science
- System Modeling & Simulation
- Systems Science and Signal Processing
- VLSI technology & Design
- Affective Computing
***
IMPORTANT DATES:
Submission Deadline: Open from now until June 30, 2017
Notification of Acceptance: 4-7 weeks from the Submission Date
Camera Ready Submission: July 21, 2017
Registration Deadline: July 21, 2017
Conference Dates: July 31 ? August 2, 2017

Last modified: 2017-01-21 02:09:49