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EMPC 2015 - 20th European Microelectronics and Packaging Conference & Exhibition

Date2015-09-14 - 2015-09-16

Deadline2015-01-15

VenueFriedrichshafen, Germany Germany

KeywordsMicroelectronics; Packaging

Websitehttp://www.empc2015.org

Topics/Call fo Papers

Si and Glass Interposers & 2.5?/?3D Packaging
The Future of Packaging
Advanced Packaging, Interconnects & Assembly / Application Fields
Materials & Processes
Modeling, Design, Test & Reliability

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Last modified: 2014-10-22 20:56:29