CEBM 2014 - 4th International Conference on Civil Engineering and Building Materials

The 2014 4th International Conference on Civil Engineering and Building Materials (CEBM 2014) will be held from November 15~16, 2014 in Hong Kong. The conference will continue the excellent tradition of gathering world-class researchers, engineers and educators engaged in the fields of Civil Engineering and Building Materials to meet and present their latest activities. You are cordially invited to attend this interesting event. This conference is co-sponsored by Asia Civil Engineering Association, the International Association for Scientific and High Technology and International Science and Engineering Research Center. After the very successful previous issues CEBM'2011 (Kunming, China) , CEBM'2012 (Hong Kong, China), CEBM'2013 (Hong Kong, China) , the CEBM'2014: 2014 4th International Conference on Civil Engineering and Building Materials will be held in Hong Kong, China.
The idea of the conference is for the scientists, scholars, engineers and students from the Universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the Universities and the industry. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
CEBM 2011, CEBM 2012 and CEBM 2013, all accepted papers has been indexed by Ei Compendex and Scopus (CEBM 2011, CEBM 2012, CEBM 2013) .
The 4th International Conference on Civil Engineering and Building Materials (CEBM 2014), all accepted papers will be published by Taylor & Francis Group that will provide supply of complimentary copies of the proceedings for citation purposes, e.g., ISI (CPCI,ISTP), EI Compendex, Scopus.
Selected excellent papers will be published by the special issues for the following Journals:
International Journal of Civil Engineering and Building Materials (IJCEBM, ISSN 2223-487X)