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ICMEE 2021 - 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021)

Date2021-05-10 - 2021-05-12

Deadline2021-03-15

VenueOsaka, Japan Japan

KeywordsMechanical Engineering; Electronics Engineering

Websitehttp://icmee.org

Topics/Call fo Papers

2021 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka International Convention Center, Osaka, Japan) during (May 10-12, 2021)-
ICMEE 2021 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc
{ History }
The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6
The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6
The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31
{ Submission Method }
1. Send your manuscript directly to conference official email: icmeeatoutlook.com
2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2021
{ Conference Scope }
The works that will be presented and published at conference will focus on, but are not limited to, the following topics:
Mechanical Engineering
Acoustics and Noise Control Marine System Design
Aerodynamics Material Engineering
Applied Mechanics Material Science and Processing
Automation, Mechatronics and Robotics Mechanical Design
Automobiles Mechanical Power Engineering
Automotive Engineering Mechatronics
...etc
{ Venue }
Osaka International Convention Center, Osaka, Japan
Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN
{ Contact }
Ms. Serene Lo
icmeeatoutlook.com
+86-028-83208181

Last modified: 2021-02-19 16:40:18